The current development of LED industry focuses on high power, high brightness and small size LED products, which will make the requirements for LED heat dissipation efficiency more and more high. However, due to the limited package size and other factors, LED cannot adopt too many active heat dissipation mechanisms. Therefore, providing a heat dissipation substrate with high heat dissipation and precise size will become the trend of LED heat dissipation substrate development in the future. The most widely used zui in the market today is copper clad aluminum based circuit board, and the thermal conductivity of the polymer resin insulating layer material in the middle is less than 1W/m K. In order to improve the thermal conductivity, high thermal conductivity ceramic powder is added to the resin material to become a high thermal conductivity aluminum substrate, which is the main idea and technology to improve the thermal conductivity of aluminum based circuit boards. However, its thermal conductivity is still limited to 0.9-3W/m.K, which is difficult to improve significantly.

The reason lies in that the resin insulation layer has become the part of the circuit board with large thermal resistance and the weakest thermal conductivity, which completely limits the real exertion of the thermal conductivity of aluminum based materials. The aluminum based circuit board fails to exert the high thermal conductivity of aluminum, which is not worthy of the name. Based on our professional research achievements in physical vapor deposition technology and diamond-like carbon materials over the years, and inspired by our friends in the LED industry around us, we found that using the ultra-high thermal conductivity and insulation of diamond-like carbon materials to replace the resin insulation layer of copper clad aluminum substrate with a thermally innovative multi film nano structure insulation layer can effectively improve the thermal conductivity of existing aluminum based circuit boards.

The conventional method of LED spotlight heat dissipation is to use ordinary heat conduction fins to dissipate heat for LED spotlight. The heat conduction performance is average and it cannot dissipate heat very well. Liquid heat dissipation A method of using liquid heat dissipation to successfully solve the heating problem of high-power LED and the heat dissipation problem of small LED spotlights, making a historic breakthrough and contributing to the problem of difficult heat dissipation of LED spotlights. Heat pipe heat dissipation uses heat pipe to dissipate heat for LED spotlights, just like heat pipe heat dissipation of computer CPU, which is bulky and bulky. There are three ways to dissipate heat: radiation, heat dissipation, conduction, heat dissipation, convection, heat dissipation. Generally, led spotlights conduct heat dissipation with aluminum sheets on the back, and then dissipate heat into the air by convection.

The current mainstream low-power LED lamp of conductive, heat-conducting and wear-resistant plastic has low power, so all heat can be poured out through your own lens, which is easy to understand. Heat dissipation is relatively difficult compared with high power. The structure of high power LED lamp beads is very different from that of low power lamp beads. Therefore, the heat dissipation of high power LED lamp beads should be solved by external forces. Some of them are fixed on aluminum plates (aluminum has good heat dissipation characteristics). For example, spotlights and the same kind of lamps, the heat dissipation problem should be solved in this way. The total output power of high power LED lamp beads is generally more than ten watts, In addition to using aluminum plates for heat conduction, it also relies on fans for heat dissipation. The principle of LED to establish light: atoms beat violently at 5 million times per second, less than 30% of the energy to establish light, and 70% of the heat is generated due to the strong beating friction. Generally, there are many elements between the LED chip and the radiator, which cannot achieve good thermal conductivity. Basically, thermal conductive glue is used to fill the gap between the chip and the radiator to reduce the working temperature.